主要应用/Application 广泛应用于大功率的高频谐振设备中 Widely used in high power high frequency resonant device 产品特点/Characteristics 电介质：聚丙烯薄膜 结构：双面金属化与金属化膜内串结构 封装：外包阻燃迈拉胶带，阻燃（94V-0级）环氧封装 引出： M6铜螺母或焊片引出 高电压、高频率、高dv/dt特性 能承受大电流 Dielectric：Polypropylene film Structure: double metal and metal film inner series structure Coating：Polyester tape wrapping with resin sealing. Flame retardant execution（UL94V-0） Terminals：M6 copper nut or lug High voltage, high frequency, high dv\/dt characteristics Can withstand high current 技术性能/Specifications 引用标准/Reference standards GB/T 17702 IEC 61071 工作温度范围/Operating temperature range -40℃～85℃ 容量范围/Capacitance 0.06μF～8μF 额定电压/Rated Voltage 1200Vdc～5000Vdc 容量偏差/Tolerance ±5%;±10% 极间耐电压/Test voltage between terminals 1.5Ur 60s 25℃±5℃ 极壳耐电压/Test voltage between terminals and case 3000V 50Hz 60s，25℃±5℃ 损耗角正切/Dissipation factor tgδ≤10×10-4 at 25℃±5℃，1kHz 绝缘电阻/Insulation resistance C×R≥5000s，at 100Vdc，25℃±5℃，60s 耐电流冲击能力/Withstand strike current ability dv/dt＞1000V/μs 杂散电感/Stray inductance ≤30nH 有效电流/Effective current 30A～100A 预期寿命/Life expectancy 200000h at Ur and 70℃